产品可靠性测试标准完整大集合(JEDEC/IEC/SAE…) |
作者:John-130 发布时间:2022-01-21 |
一、 JEDEC标准: 1.JEDEC JESD22 全系列可靠性测试标准集(包含下面全部38份最新英文电子版标准文件).rar 2.JEDEC JESD22-A100E:2020 Cycled Temperature-Humidity-Bias with Surface Condensation Life Test (循环温度-湿度-偏差与表面凝结寿命测试 ) 3.JEDEC JESD22-A101D.01:2021 Steady-State Temperature-Humidity Bias Life Test(稳态温度-湿度偏差寿命测试) 4.JEDEC JESD22-A102E:2015(R2021) Accelerated Moisture Resistance - Unbiased Autoclave (加速的耐湿性-无偏高压灭菌器) 5.JEDEC JESD22-A103E:2015 High Temperature Storage Life(高温储存寿命) 6.JEDEC JESD22-A104F :2020 Temperature Cycling(温度循环) 7.JEDEC JESD22-A105D:2020 Power and Temperature Cycling(功率和温度循环) 8.JEDEC JESD22-A106B.01:2016 Thermal Shock(热冲击) 9.JEDEC JESD22-A107C:2013 Salt Atmosphere(盐雾) 10.JEDEC JESD22-A108F:2017 Temperature, Bias, And Operating Life(温度,偏置和使用寿命) 11.JEDEC JESD22-A109B:2011 HERMETICITY(气密性) 12.JEDEC JESD22-A110E:2015 Highly Accelerated Temperature and Humidity Stress Test (HAST) - 高加速温度和湿度应力测试(HAST) 13.JEDEC JESD22-A111B :2018 Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices(通过小型表面安装固态器件的全身焊锡浸入确定底部侧板连接能力的评估程序) 14.JESD22-A113I:2020 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing - 可靠性测试前的非封闭表面贴装器件的预处理 15.JEDEC JESD22-A117E:2018 Electrically Erasable Programmable ROM (EEPROM) Program Erase Endurance and Data Retention Stress Test(电可擦除可编程 ROM (EEPROM) 程序擦除耐久性和数据保留压力测试) 16.JEDEC JESD22-A118B.01:2021 Accelerated Moisture Resistance - Unbiased HAST(加速的耐湿性-无偏的HAST) 17.JEDEC JESD22-A119A:2015 Low Temperature Storage Life(低温储存寿命 ) 18.JEDEC JESD22-A120B:2014 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in Organic Materials Used in Electronic Devices(电子设备中使用的有机材料中水分扩散率和水溶性的测量方法) 19.JEDEC JESD22-A121A(R2019) Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes(测试锡和锡合金表面处理中晶须生长的测试方法) 20.JEDEC JESD22-A122A:2016 Power Cycling(功率循环) 21.JEDEC JESD22-B100B:2003 Physical Dimensions(物理尺寸) 22.JEDEC JESD22-B101C:2015 External Visual(外观) 23.JEDEC JESD22-B102E:2007 Solderability(可焊性) 24.JEDEC JESD22-B103B.01:2016 Vibration, Variable Frequency(振动,变频) 25.JEDEC JESD22-B105E:2018 Lead Integrity(引线完整性) 26.JEDEC JESD22-B106E:2016Resistance to Solder Shock for Through-Hole Mounted Devices (通孔安装器件的抗焊接冲击性 ) 27.JEDEC JESD22-B107D:2011 Mark Permanency(标记永久性) 28.JEDEC JESD22-B108B:2010 Coplanarity Test for Surface-Mount Semiconductor Devices( 表面贴装半导体器件的共面性测试 ) 29.JEDEC JESD22-B109C:2021 Flip Chip Tensile Pull(倒装芯片拉伸强度) 30.JEDEC JESD22-B110B.01:2019 Mechanical Shock – Device and Subassembly(机械冲击 - 设备和组件) 31.JEDEC JESD22-B111A:2016 Board Level Drop Test Method of Components for Handheld Electronic Products(手持式电子产品元件的板级跌落测试方法) 32.JEDEC JESD22-B112B :2018 Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature(高温下的表面贴装集成电路的封装翘曲测量) 33.JESD22-B113B:2018 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products - 用于手持电子产品的SMT IC的互连可靠性表征的板级循环弯曲测试方法 34.JEDEC JESD22-B114B:2020 Mark Legibility(标记易读性) 35.JEDEC JESD22-B115A.01:2016 Solder Ball Pull(焊球拉力 ) 36.JEDEC JESD22-B116B:2017 Wire Bond Shear Test Method(引线键合剪切测试方法) 37.JEDEC JESD22-B117B:2014 Solder Ball Shear(焊球剪切测试) 38.JEDEC JESD22-B118 :2011 Semiconductor Wafer and Die Backside External Visual Inspection(半导体晶圆和芯片背面外部外观检查) 39.JEDEC JESD22-B119:2018 Mechanical Compressive Static Stress Test Method( 机械抗压静态应力测试法) 40.ANSI/ESDA/JEDEC JS-001-2017 Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) -Component Level (静电放电敏感度测试 - 人体模型(HBM)- 器件级别) 41.JEP70C:2013 Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware(有关电子硬件质量和可靠性的标准和出版物指南) 42.JEDEC JEP176:2018 ADAPTER TEST BOARD RELIABILITY TEST GUIDELINES(适配器测试板可靠性测试指南) 43.JEDEC JEP180.01:2021 Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices (氮化镓功率转换器件的开关可靠性评估程序指南 ) 二、 SAE标准 1.SAE GEIA-STD-0009A:2020 Reliability Program Standard for Systems Design, Development, and Manufacturing(系统设计,开发和制造的可靠性计划标准) 2.SAE TAHB0009A Reliability Program Handbook(可靠性计划手册) 三、 IEC标准 1.IEC 60300 Series Dependability management(可靠性管理全系列) - 包含下面全部12份最新英文版标准文件.rar 2.IEC 60300-1:2014 Dependability management - Part 1:Guidance for management and application(可靠性管理–第一部分:管理和应用指南) 3.IEC 60300-3-1:2003 Dependability management - Part 3-1:Analysis techniques for dependability - Guide on methodology (可靠性管理–第3-1部分:可靠性的分析技术–方法指南 ) 4.IEC 60300-3-2:2004 Dependability management - Part 3-2:Application guide - Collection of dependability data from the field(可靠性管理 - 第3-2部分:应用指南 - 从现场收集可靠性数据) 5.IEC 60300-3-3:2017 Dependability management-Part 3-3:Application guide - Life cycle costing(可靠性管理-第3-3部分:应用指南-生命周期成本计算) 6.IEC 60300-3-4:2007 Dependability management - Part 3-4:Application guide - Guide to the specification of dependability requirements(可靠性管理 - 第 3-4 部分:应用指南 - 可靠性要求规范指南) 7.IEC 60300-3-5:2001 Dependability management - Part 3-5:Application guide - Reliability test conditions and statistical test principles (可靠性管理-第3-5部分:应用指南-可靠性测试条件和统计测试原理) 8.IEC 60300-3-10:2001 Dependability management - Part 3-10:Application guide - Maintainability (可靠性管理 - Part 3-10:应用指南 - 可维护性) 9.IEC 60300-3-11:2009 Dependability management - Part 3-11:Application guide - Reliability centred maintenance(可靠性管理 - Part 3-11:应用指南 - 以可靠性为中心的维护) 10.IEC 60300-3-12:2011 Dependability management- Part 3-12:Application guide - Integrated logistic support(可靠性管理- Part 3-12:应用指南-综合后勤保障) 11.IEC 60300-3-14:2004 Dependability management - Part 3-14:Application guide - Maintenance and maintenance support(可靠性管理 - Part 3-14:应用指南 - 维护和维护支持) 12.IEC 60300-3-15:2009 Dependability management - Part 3-15:Application guide - Engineering of system dependability(可靠性管理 - Part 3-15:应用指南 - 系统可靠性工程) 13.IEC 60300-3-16:2008 Dependability management - Part 3-16:Application guide - Guidelines for specification of maintenance support services(可靠性管理 - 第 3-16 部分:应用指南 - 维护支持服务规范指南) 14.IEC 60706/60300 Standard - Maintainability(IEC标准 - 可维修性) - 包含全部5份最新英文版文件.rar 15.IEC 60706-2:2006 Maintainability of equipment - Part 2:Maintainability requirements and studies during the design and development phase(设备的可维护性 - 第 2 部分:设计和开发阶段的可维护性要求和研究) 16.IEC 60706-3:2006 Maintainability of equipment - Part 3:Verification and collection, analysis and presentation of data (设备的可维护性-第3部分:数据的验证和收集、分析和呈现) 17.IEC 60706-5:2007 Maintainability of equipment - Part 5:Testability and diagnostic testing (设备的可维护性 - 第 5 部分:可测试性和诊断测试) 18.IEC 60300-3-10:2001 Dependability management - Part 3-10:Application guide - Maintainability (可靠性管理 - Part 3-10:应用指南 - 可维护性) 19.IEC 60300-3-14:2004 Dependability management - Part 3-14:Application guide - Maintenance and maintenance support(可靠性管理 - Part 3-14:应用指南 - 维护和维护支持) 20.IEC 61123:2019 Reliability testing - Compliance test plans for success ratio(可靠性测试-成功率的合规性测试计划) 21.IEC 61163-1:2006 Reliability stress screening - Part 1:Repairable assemblies manufactured in lots(可靠性试验–第1部分:成批生产的可修复组件) 22.IEC 61163-2:2020 Reliability stress screening - Part 2:Components(可靠性试验 - 第二部分:组件) 23.IEC 62347:2006 Guidance on system dependability specifications(系统可靠性规范指南) 24.IEC 62628:2012 Guidance on software aspects of dependability(关于软件可靠性方面的指南) 25.IEC 62673:2013 Methodology for communication network dependability assessment and assurance(通信网络可靠性评估和保证的方法 26.IEC/TS 62775:2016 Application guidelines - Technical and financial processes for implementing asset management systems (应用指南-实施资产管理系统的技术和财务流程) 27.IEC 62853:2018 Open systems dependability(开放系统的可靠性) 28.IEC 62960:2020 Dependability reviews during the life cycle(生命周期中的可靠性审查) 四、IEEE标准 1.IEEE Std 982.1 - 2005 Dictionary of Measures of the Software Aspects of Dependability(可靠性软件方面的度量词典) 五 BS/EN标准 1.BS EN 61078:2016 Reliability Block Diagrams(可靠性框图) 六、 CTIA标准 1.CTIA-Certification Device Hardware Reliability Certification Program(认证设备硬件可靠性认证计划) 七、 EIAJ标准(日本) 1.EIAJ ED-4701 半导体器件的环境和耐久性测试方法- 包含下面全部7份英文电子版标准文件.rar 2.EIAJ ED-4701/001:2001 Environmental and endurance test methods for semiconductor devices(General) -半导体器件的环境和耐久性测试方法(通用) 3.EIAJ ED-4701/100:2001 Environmental and endurance test methods for semiconductor devices(Life test I) - 半导体器件的环境和耐久性试验方法(寿命试验 I) 4.EIAJ ED-4701/200:2001 Environmental and endurance test methods for semiconductor devices(Life test II) -半导体器件的环境和耐久性试验方法(寿命试验 II) 5.EIAJ ED-4701/300:2001 Environmental and endurance test methods for semiconductor devices(Stress test I) - 半导体器件的环境和耐久性试验方法(应力试验 I) 6.EIAJ ED-4701/300-3:2006 Environmental and endurance test methods for semiconductor devices(Stress test I)-Amendment 3(半导体器件的环境和耐久性测试方法(压力测试 I)-修正案 3) 7.EIAJ ED-4701/400:2001 Environmental and endurance test methods for semiconductor devices(Stress test II) - 半导体器件的环境和耐久性测试方法(应力测试II) 8.EIAJ ED-4701/500:2001 Environmental and endurance test methods for semiconductor devices(Miscellaneous)-半导体器件的环境和耐久性试验方法(杂项) 八、国标 1.GB/T 9414全系列 - 维修性 - 包含GB/T 9414.1/2/3/5/9共5份最新的中文国家标准.rar 九、AECQ标准 其它JEDEC检查测试类标准 1.JEDEC JESD86A(R2020) Electrical Parameters Assessment( 电参数评估) 2.JEDEC JEP95 Design Registration 4.14 Design Requirements - Ball Grid Array Package (BGA) - 设计注册 4.14 - 设计要求 - 球栅阵列封装(BGA) 3.JEDEC JEP155B:2018 Recommended ESD Target Level for HBM Qualification(HBM认证的推荐ESD目标水平) 4.JEDEC JEP170:2013 Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA) - 倒装芯片类型组件(FCxGA)的外观检查和控制指南 5.JEDEC JESD402-1:2020 Temperature Grade and Measurement Specifications for Components and Modules (组件和模块的温度等级和测量规范) 6.JEDEC JESD671D:2018 Device Quality Problem Analysis and Corrective Action Resolution Methodology(设备质量问题分析和纠正措施解决方法) 7.JEDEC PS-005A:2020 DDR5 288 Pin U/R/LR DIMM Connector Performance Standard(DDR5 288针U/R/LR DIMM连接器性能标准) ———————————————— 版权声明:本文为CSDN博主「John-130」的原创文章,遵循CC 4.0 BY-SA版权协议,转载请附上原文出处链接及本声明。 原文链接:https://blog.csdn.net/Johnho130/article/details/117413710
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